High Performance: Suitable for thermal paste CPU, GPU, heatsink, ovens, IC chipset, PS4/PS5/Xbox, high-power LED, and other components.
Extreme thermal conductivity: Equipped with an ultra-high thermal conductivity of 12.8W/m·K, which is significantly better than the industry standard, it can quickly export heat from high-load chips such as the CPU/
GPU and reduce core temperature.
High-Quality Compound: Helps disperse the heat from CPU to heatsink effectively.
Non-Electrical Conductive: No risk of short circuit, safe to use on many types of radiators, provides better protection.
