Description
| The thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. The minus pad extreme is electrically insulating.
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| Application | Rating |
| Thermal Conductivity | ***** |
| Sub-Zero Overclocking | * |
| Overclocking | **** |
| Water Cooling | ***** |
| Air Cooling | ***** |
| Silicone Sensitive Areas | — |
| within the capabilities of thermal pads Hardness Shore 00 - 65 | |
